Solder joint structure



V Patented Aug. 9, 1932 UNITED STATES PATENT OFFICE BAY I". J'AGKSON, OFBERKELEY, CALIFORNIA, ASSIGNOB '10 WESTINGHOUSE MUTBIO & MANUFACTURINGCOMPANY, A CORPORATION OF PENNSYLVANIA SOLDIER JOINT STRUCTUREApplication meam 1c, 1929. mm 1111. 878,888.

My invention relates to solder-joint structures and particularly tomeansfor soldering inorganic dielectricbodies, such as porcelainmembers, to metal bodies or to other similarly prepared dielectricbodies.

One object of my invention is to provide a device of the above-indicatedcharacter that shall facilitate the soldering of the insulating memberto a metalmember by a usual solder- 10 ing operation.

Another object of my inventioifis to provide a method of preparing aninorganic dielectricbody having a superficial film of metal joinedintegrally thereto, for solderin to another article by a relativelyunskllledo erator.

, A furt er object of my invention is to provide a device of theabove-indicated character that shallbe Simple and durable inconstruction,-economical to manufacture and effective in its operation.

It has heretofore been suggested, in connection with members ofinorganic dielectric materials, such as glass and porcelain, to providemetallic-glaze surface films thereon to permit the soldering of metallicmembers thereto. By reason of the properties of the film of metalon'the' dielectric member, however, special skill is usually requiredto. effect adequate joinder of a metal body thereto.

Operators, skilled soldering metal-tometal, have difliculty in efiectingpermanent flu d-tight and mechanically strong soldered j'tiint's betweenthe superficial metal film and art of making good metal-to-metalsoldered.

joints may readily solder metal to porcelain, and thereby promote thefurther use and effective operation of such joints.

Accordingly, in practicing mv invention, I provide an inorganicdielectric body having a superficial metal-glaze film thereon and amethod ofso preparing the film as to render the body towhioh it is tobesoldered, and it. is necessary, in order to construct an efiectivethesoldering of another'body thereto a relatively simple operation, andwell within the skill of an ordinary solder worker.s

Figure 1 of the accompanying drawing is a view in longitudinal sectionof a cable joint or conduit structure embodying my invention, and

Figs. 2, 3 and 4 are detail views of modifications of portions of thedevice shown in Fig. 1.

i The device comprises in general a dielectric body" 2, members 3 and 4to be connected thereby, and members 5 and 6 for efiectin a fluid-tightconnection between the severa members 3 and 2, and 4 and 2,respectively.

The member 2 is preferably constructed of inorganic dielectric material,such as porcelain, and, in this instance, is in the form of a tubehaving an annular intermediate outer ridge 8 and slightly tapered orfrusto-conical outer surfaces 9 converging away fromthe ridge 8. J

The porcelain member 2 is initially constructed in a usual manner bycoating with a silicate glaze and'firing in a kiln. After it has beenremoved from the kilnand cooled,

metallic bands or films 10, in the form of a ligluid solution, areplaced on'the surfaces 9, w

ile in a wet state, and returned to the kiln for further firingoperation, during which thebands 10 become metallized in integraljoin'der to the body2 and of lustrous metallic character, A preferredmaterial or glaze for the bands 10, as heretofore employed, comprises,in addition to the essential oils of lavender and spike, about 7.85%metallic residue containing approximately 4.3% platinum, in the form ofplatinic chloride or metal,3.1% gold, in the form of gold chloride ormetal. 0.3% bismuth in the form of chloride or metal. and about 0.1%insoluble residue.

- Although members similar to the members 5 and 6 may be. soldereddirectly to'the metallic bands or films 10. special skill is required'to efiect agood fluid-tight permanent joint Difliculty in soldering tothe bands or films.

is caused by the brittle nature of the member 2 and by the 'extremethinness and other characteristics of the films or bands 10, wherebylocal application of the relatively high soldering temperatures causesdamage to the films and to the member 2, and insufficient temperaturesfail toeflect a good joint.

To overcome the above-mentioned features,

and to enable an ordinary solder worker to effect 9. 00d joint, sleeves12 are provided on the fiIms 10 to give more body or thickness to thebands, and to conduct heat away from spots or local application toprevent dama e to the device and to render the makin 0 the joints simpleand effective.

fihe sleeves 12 preferably comprise layers of wire wound tightly aboutthe body 2 and secured thereto.

It is preferable also that the sleeves 12 consist of tinned wire so thatwhen subjected to heat, the soldering agent is present, although furthersolder may be applied during the heating operation.

The sleeves 12, in the form shown, irre-' spective of how tightly andclosely they are wound, provide spaces between the turns, so that thesolder or tinned coatings thereon, and further solder which may besupplied, flows freely around and about the turns to cohere to thebandslO and to provide an outer base or film to which the members 5 and6 may be readily soldered by an ordinary soldering operation. Thesleeves 12 being of copper, or similar good heat-conducting metal notfusible at the soldering temperatures, readily conduct heat from anypoint of local application,so that such local application may bemaintained long enough to effect a good solder 'oint without damage tothe refractory insu ating material.

It is also contemplated in my invention that the bands or films 10 ofmetallic glaze may, in certain instances, be omitted and thesleevesl2'wound on the body 2 so tightly' asto effect a good joint forcertain purposes. In the latter construction, the relatively soft tinnedcoating on the wire of the sleeves 12 flattens against the body 2, oryields with the tension]? under which the wire is applied, to'form arelatively fluid-tight seal with respect to the member 2, especiallyafter the application of heat.

Also, the surfaces 9 may be roughened, grooved or provided withshoulders to better seat the wire turns and to reinforce the .sleeve 12against longitudinal forces between the member 2 and the member's 5 and6, as shown in Figs. 3 and 4. I

As shownin Fig. 2, the sleeve 12, instead of being wound, as in theabove-described structure, is of perforate-sheet or screen form which,if of complete ring or band shape, may be-placed over the ends of thebody 2 with considerable longitudinal force or, if split, may be clampedunder perimetral tension about thebody 2 while the soldering heat isapplied. v I While I have shown and described particuappended claims.

the film.

effected therein without departing from the spirit and scope thereof, asset forth in the I claim as my invention: 1. In combination, a body ofinorganic dielectric material, a fired superficial film of metal joinedintegrally thereto, and a metalcoated metal element on said film, aninner portion of the metal coating of said element being joinedintegrally to the film and an outer portion of said coating constitutingmeans for'joining another element thereto.

2.- In combination, a body of inorganic dielectric material, a firedsuperficial film of metal joined integrally thereto,.and a perforatesheet-like metalelement on the film, said element being metal coated onboth sides with the inner and outer coating portions joined integrallythrough a perforate portion thereof and the inner portionjoinedintegrally to 3. In combination, a body of inorganic dielectricmaterial, a fired superficial film of metal joined integrally thereto, ametal element on said film, a metal bonding medium between, and joinedintegrally to, the film and the element, and a metal bonding medium ofthe same material as said first medium on the outer surface of theelement.

'4. In combination, a tubular body of in- I organic dielectric material,tubular fired superficial films of metal longitudinally spaced. thereonin integral joinder thereto, metal sleeves on said films, and a metalbonding medium on both sides of the sleeves connected throughperforations in the sleeve side walls joined integrally to the films.

5. In combination, a tubular body of inorganic dielectric material,tubular fired superficial films of metal longitudinally spaced thereonin integral joinder thereto, and metal sleeves each having a singlecoat- .ing of one material extending to both sides thereof and disposedon one of said films, porti onsof said coatingat one side of the sleevebeing joined integrally to one of the films and a portion of the coatingat the other side of the sleeve constituting a'base for joining anelement integrally thereto.

6. In combination, a tubular silicate- Ill Ill

glazed porcelain body including an intermediate annular outer ridge andouter substantially frusto-conical surfaces cbnv ergingly sloped frompositions adjacent to said ridge to'positions adjacent to the ends ofthe body, fired superficial films of metal substantially entirelycovering said surfaces, in integral ioinder to the body, copper sleevesconforming to. and substantially entirely covering, said films inrelatively close relation thereto, said sleeves having lateral aperturestherethrough' distributed substantially uniformly throughout the .areathereof, and solder on both sides-of the sleeves connected through theperforations of the sleeves, the inner solder being joined integrally tothe films and the outer solder constituting a base for soldering a metalelement thereto.

7 In combination, a body of inorganic dielectric material, a film ofmetal; thereon, a sleeve-like band of tightly wound metal wire withconstituting substantially only a thick- I ened metal coating on, anddisposed within the confines of, the dielectric body.

In testimony whereof I have hereunto sub scribed my name this 10th dayof Jul 1929.

' RAY P. JACK ON.

over said film, and a metal bonding medium 7 holding the wireconvolutions in tightlywound relation to eachother and to said film.

8. In combination, a body of inorganic dielectric material having ametal coating thereon, and a tightly-wound metal-coated metal vwiresoldered in position to said coating.

9. The method of preparing an inorganic dielectric main body having a.fired superplacing a metal element having a fusible metal; coatingthereon against said film and subjecting the 'parts to heat whileapplying further fusible-metal bonding material to join said element andits coating integrally to I the film.

; a portion of the dielectric body over said coat- 11. The method ofpreparing aninorganic dielectric body having a metal coating thereon forfluid-sealed solder-attachment to another body which includes solderinga good solder-assuming metal element to said coat- .ficial film of metalthereon .for solder attaching in relatively tight binding sealed holdingrelation to the dielectric body.

12. The method of preparing an inorganic dielectric body having a metalcoating thereon for fluid-sealed solder-attachment to another body whichincludes winding a good solder-assuming flexible metal element inrelatively tight binding sealed relation about ing and in fixing theelement to said coating.

13. The method of preparinga meta coated inorganic dielectric body forfluidsealed solder-attachment to another body which includes winding aflexible metal element having a solder-assuming cover of softer,

' metal in sufiiciently tight binding relation about asaid'coating tocause the cover to yield against ortion of the dielectric body over thedielectric body and in fixing the element in position.

14.. In combination a body of inorganic dired superficial film of. metalj oined integrally thereto and means for electric material, a

- facilitating the soldering of another body to said first bodyincluding a preformed metal element infusib'le at the solderintemperature-'but'having' go'od-characteristlcs for soldering theretosoldered to the film and there-

